Mike Regan is the Director of Engineering and Operations at HP’s Malaysia Manufacturing for pen assembly and new products. He is an experienced leader with over 25 years at HP Inc., with an extensive track record in R&D, New Products, and Manufacturing. Previously he was in Singapore as Director of the 3D Digital Manufacturing Lab, a research initiative between HP & Nanyang Technological University. He started his career as a MEMS process and design engineer in the US, after which he transitioned into greater management roles in Print and Innovation. He holds a PhD in Applied Physics from Stanford University and has 24 US-issued patents.